Silicone foam for filling IGBT electronic components
- Product Usage:IGBT electronics potting silicone foam is an innovative sealing product, which can reduce the process flow, improve the production efficiency and reduce the comprehensive cost, and has better sealing performance. IGBT electronic component potting foam is a kind of instant foaming sealant, which foams and forms on the surface of the device in liquid form. It is suitable for various sealing surfaces of battery packs, which is easy to achieve industrial automation and standardization.
Description
BACKGROUND ENVIRONMENT OF IGBT ELECTRONIC COMPONENTS ENCAPSULATED SILICONE FOAM
High voltage and high-power power electronic equipment can realize the flexible transformation and regulation of electric energy, and is the key equipment in DC transmission technology. The core of high-voltage and high-power power electronic equipment is high-voltage and high-power power electronic devices. Insulated gate bipolar transistor (IGBT) combines the advantages of high frequency, high voltage and large current, and is internationally recognized as the most representative product of the third revolution of power electronics technology. The preparation process of materials will determine the performance of materials. Packaging high-power semiconductor modules with high-performance materials will help improve the quality and reliability of modules.
APPLICATION OF SILICONE FOAM FOR FILLING IGBT ELECTRONIC COMPONENTS
IGBT electronics potting silicone foam is an innovative sealing product, which can reduce the process flow, improve the production efficiency and reduce the comprehensive cost, and has better sealing performance. IGBT electronic component potting foam is a kind of instant foaming sealant, which foams and forms on the surface of the device in liquid form. It is suitable for various sealing surfaces of battery packs, which is easy to achieve industrial automation and standardization.
CHARACTERISTICS OF SILICONE FOAM FOR FILLING IGBT ELECTRONIC COMPONENTS
1. Excellent compression deformation property and resilience
2. The density is lower and the material is lighter, which meets the needs of automobile lightweight.
3. Good processability, improve production efficiency and reduce production cost.
