Silicone gel potting for submarine cable potting
- Product Usage:IGBT electronic component potting silicon gel is an addition molding high temperature resistant and high transparent silicon gel. After the AB component is mixed and cured in 70 ° C / 1H through polymerization, a durable silicone elastomer film is formed on IGBT electronic components.
Description
DESCRIPTION OF SILICON GEL FOR IGBT ELECTRONIC COMPONENTS POTTING
IGBT electronic component potting silicon gel is an addition molding high temperature resistant and high transparent silicon gel. After the AB component is mixed and cured in 70 ° C / 1H through polymerization, a durable silicone elastomer film is formed on IGBT electronic components. In addition to effectively protecting sensitive components from water, gas, oil or dirt, this high-temperature resistant film also ensures that IGBT can maintain stable and reliable operation under extreme high temperature and harsh environment. This new generation of high-temperature resistant silicon gel completely solves the high-temperature resistance, softness and stability requirements of the silicon carbide IGBT module of the new energy vehicle manufacturer.
THE REQUIREMENTS OF HIGH VOLTAGE AND HIGH POWER IGBT MODULE FOR POTTING GLUE MAINLY INCLUDE:
* The potting adhesive material has high insulation strength, which is sufficient to ensure the insulation of the passivation layer of the chip terminal and the three junction points inside the device at the electric field concentration positions;
* The preparation of potting adhesive material has no by-products;
* The potting adhesive material has certain heat-resistant, waterproof and mechanical properties.
* The special silicon gel for IGBT provided by AYAAON can meet the above conditions
OTHER ADVANTAGES OF AYAAON BRAND IGBT ELECTRONIC COMPONENTS ENCAPSULATED WITH SILICONE GEL
1. As a special electronic potting material, silicone gel not only has the unique weather resistance and aging resistance, excellent high and low temperature resistance, good hydrophobicity and electrical insulation properties of silicone potting adhesive, but also has the advantages of low internal stress, good impact resistance and strong adhesion. It is the preferred material for IGBT module potting.
2. The silicone gel for silicon-based IGBT module encapsulation is a two-component addition room temperature or heating vulcanized silicone gel. As shown in the figure below, silicon gel fills all the gaps in the module, plays a role in preventing moisture, dust, corrosion, shock and isolation, improves the pressure resistance level of the module, seals all components in the module and protects the chip.
