• Heat dissipation encapsulation silicone

Heat dissipation encapsulation silicone

  • Product Usage:Heat dissipation silicone elastomer, also known as thermal conductive silicone gel and thermal conductive silicone rubber, is a thermal conductive material. It is often used in motor controller, power supply, computer and automotive electronics in the form of thermal conductive silicone film.
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Description

INTRODUCTION OF HEAT DISSIPATION ENCAPSULATION SILICONE

Heat dissipation silicone elastomer, also known as thermal conductive silicone gel and thermal conductive silicone rubber, is a thermal conductive material. It is often used in motor controller, power supply, computer and automotive electronics in the form of thermal conductive silicone film. In addition, the cooling of chips such as military products usually involves the contact cooling of electronic devices or mechanical structures, which is used to reduce the contact thermal resistance and enhance the heat transfer of the contact interface, and will directly improve the performance, accuracy and reliability of the equipment or system itself



ADVANTAGES OF HEAT DISSIPATION ENCAPSULATION SILICONE

1.Silicone glue from AYAAON is two components silicone potting compound, which is suitable for encapsulating various electronic components working in harsh environments

2. Strong anti-aging ability, good weather resistance and excellent impact resistance;

3. No corrosivity to electronic components and no by-products are produced during curing reaction;

4. It can be cured at room temperature or at elevated temperature. It has good self de bubble property and is more convenient to use; The curing shrinkage is small, and it has excellent waterproof performance and seismic resistance.

5. It has excellent resistance to cold and hot changes, can be used in a wide range of operating temperatures, and can maintain elasticity in the temperature range of - 60 ℃~200 ℃ which is no cracking potting compound;

6. It has excellent electrical performance and insulation capacity. After potting, it can effectively improve the insulation between internal components and lines, and improve the use stability of electronic components;

7. It has excellent thermal conductivity and flame retardancy, effectively improving the heat dissipation capacity and safety factor of electronic components; Low viscosity, good fluidity, able to penetrate into small pores and components;

8. It has excellent cold and heat resistance, aging resistance and electrical insulation performance. It also has excellent moisture-proof, anti-seismic, corona resistant, anti leakage and chemical resistance


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