Insulation potting compound AB silicone for electronic devices
- Product Usage:Electronic components are generally sealed with electronic potting adhesive, which is mainly used for potting, sealing, bonding and coating protection of electronic components. Before curing, the electronic potting compound is liquid polymer.
Description
INTRODUCTION OF INSULATION POTTING COMPOUND AB SILICONE FOR ELECTRONIC DEVICES
Electronic components are generally sealed with electronic potting adhesive, which is mainly used for potting, sealing, bonding and coating protection of electronic components. Before curing, the electronic potting compound is liquid. As the name implies, the liquid electronic potting adhesive is poured into the product we need to encapsulate, and then left to be cured. After curing, it can play the role of insulation, waterproof and moisture-proof, dust-proof, heat conduction, confidentiality, anti-corrosion, temperature resistance and shock resistance.
APPLICATION OF INSULATION POTTING COMPOUND AB SILICONE FOR ELECTRONIC DEVICES
This product is mainly used for encapsulating electronic components with weather resistance, insulation and high heat dissipation requirements. For example, the insulation, heat conduction and temperature resistant potting of communication modules of various specifications, micro transformers and line output integrated transformers can resist high temperature, insulation, sealing, waterproofing, environmental pollution, stress and various vibrations, and achieve the goal of long-term and reliable protection of sensitive circuits and components.
CHARACTERISTICS OF OF INSULATION POTTING COMPOUND AB SILICONE FOR ELECTRONIC DEVICES
The two components AB glue provided by AYAAON has low viscosity and is easy to de bubble. It is suitable for potting and molding, so that the electronic devices has good durability and reliability. If it is a highly transparent AB glue, it has high refractive index and high transmittance, which can protect the electronical devices and increase the luminous flux of the LED.
In a word, the electronic potting compound has low viscosity and good fluidity, which is suitable for the molding of electronic accessories. After curing, it forms soft rubber with good impact resistance. Excellent heat resistance, moisture resistance and cold resistance, which can extend the life of electronic accessories after application. It can be added and solidified at room temperature and temperature, with excellent moisture-proof and waterproof effects
