Epoxy resin potting adhesive high hardness pcb circuit board power transformer electronic circuit board main board filled with AB glue waterproof insulation confidential potting adhesive

INTRODUCTION OF EPOXY POTTING COMPOUND

Epoxy potting is AB glue, low viscosity, good fluidity, easy to penetrate into the product gap; Epoxy potting compound can be cured at room temperature or medium temperature with moderate curing speed; After curing, there is no bubble, the surface is smooth, shiny, and the hardness is high; The cured product has good acid and alkali resistance, good moisture, water, oil, and dust resistance, and resistance to damp and heat and atmospheric aging. It has good electrical and physical properties such as insulation, compression resistance, and high bonding strength.

APPLICATION OF EPOXY RESIN POTTING

Epoxy resin potting adhesive is widely used for the encapsulation protection of circuit modules, automotive electronic modules, ignition coils, ignition modules, power modules, electronic components, PCB boards, etc. and the confidentiality of electronic products.

CHARACTERISTIC OF EPOXY POTTING COMPOUND

Automatic leveling

Automatic bubble discharge

High and low temperature resistance

Moisture-proof

High adhesion

Waterproof

Flame retardant

Insulation

Heat conduction